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Description
Product Info
The Professional Thermally Conductive Epoxy Adhesive is a high-performance, two-part epoxy designed for outstanding thermal conductivity and adhesion. This adhesive utilizes a specialized filler to enhance thermal conductivity while providing a strong bond.
Features
- High adhesive strength for reliable bonding
- Slight tack allows for pre-assembly, making application easier
- Good surface wet-out for optimal adhesion
- Low viscosity suitable for potting applications
- Effective gap filling capabilities
- Thin bonding line ensures a clean finish
- Thermal conductivity rating of 0.8-1.4 W/m-K
- Low chloride ion content and minimal outgassing for safety
Technical Specifications
For detailed specifications, please refer to the following:
| Specification | Measurement |
|---|---|
| Volume | 50ml |
| Thermal Conductivity | 0.8-1.4 W/m-K |
| Viscosity | Low |
FAQ
What is the curing time for this adhesive?
The curing time may vary based on environmental conditions, but typically it cures within a few hours.
Can this adhesive be used on electronic components?
Yes, it is suitable for use on electronic components due to its low chloride content and minimal outgassing.
Is it safe to use in enclosed spaces?
Yes, the low outgassing nature makes it safe for use in enclosed spaces, but ensure proper ventilation during application.
About Us
Suppliers to Ministry of Defence, NATO, US Airforce and Most UK Councils, Schools, Universities, Hospitals & various Government departments
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